Cheikh Tidiane Dia

Université Paris Ouest, LTIE
EA4415, GTE, 50 R. de Sèvres, 92410 Ville d’Avray - France

ANALYTICAL THERMAL MODELLING OF MULTILAYERED ACTIVE EMBEDDED CHIPS INTO HIGH DENSITY ELECTRONIC BOARD

ANALYTICAL MODELING OF MULTI-LAYERED PRINTED CIRCUIT BOARD USING MULTI-STACKED VIA CLUSTERS AS COMPONENT HEAT SPREADER