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Eric Monier-Vinard
Thales Global Services
92366 Meudon la foret Cedex - France
Najib Laraqi
,
Eric Monier-Vinard
,
Cheikh Tidiane Dia
,
Minh Nhat Nguyen
,
Valentin Bissuel
ANALYTICAL THERMAL MODELLING OF MULTILAYERED ACTIVE EMBEDDED CHIPS INTO HIGH DENSITY ELECTRONIC BOARD
Paper
PDF
DOI
Najib Laraqi
,
Eric Monier-Vinard
,
Cheikh Tidiane Dia
,
Valentin Bissuel
,
Minh-Nhat Nguyen
ANALYTICAL MODELING OF MULTI-LAYERED PRINTED CIRCUIT BOARD USING MULTI-STACKED VIA CLUSTERS AS COMPONENT HEAT SPREADER
Paper
PDF
DOI