ANALYTICAL THERMAL MODELLING OF MULTILAYERED ACTIVE EMBEDDED CHIPS INTO HIGH DENSITY ELECTRONIC BOARD

Abstract

The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyse the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.

Keywords

Dates

  • Submission Date2012-08-26
  • Revision Date2013-05-25
  • Acceptance Date2013-05-25
  • Online Date2013-06-16

DOI Reference

10.2298/TSCI120826072M

References

  1. Culham J.R., Yovanovich M.M. and Lemczyk, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution, ASME Journal of Electronic Packaging, 122 (2000), 3, pp. 233-239.
  2. Muzychka Y.S, Yovanovitch M.M., Culham J.R, Influence of geometry and edge cooling on thermal Spreading resistance, Journal of thermo-physics and heat transfer, 20 (2006), 2, pp. 247-255
  3. Ellison G.N, Maximum thermal spreading resistance for rectangular sources and plates with non unity aspect ratio, IEE transaction on components and packaging technologies, 26 (2003), 2, pp. 439-454.
  4. Rinaldi N., Generalized image method with application to the thermal modeling of power devices and circuits, IEE transactionson electronic devices, 49 (2002), 4, pp. 679-686.
  5. Laraqi, N., Thermal impedance and transient temperature due to a spot of heat on a half-space, International Journal of Thermal Sciences, 49 (2010), 3, pp. 529-533.
  6. Hristov, J., El Ganaoui, M., Thermal impedance estimations by semi-derivatives and semi-integrals: 1-D semi-infinite cases. Thermal Science, 17 (2012), 2, pp. 581-589.
  7. Baïri, A., Alilat, N., Bauzin, J.G., Laraqi, N., Three-dimensional stationary thermal behavior of a bearing ball, International Journal of Thermal Sciences, 43 (2004), 6, pp. 561-568.
  8. Laraqi, N., Scale analysis and accurate correlations for some Dirichlet problems involving annular disc, International Journal of Thermal Sciences, 50 (2011), 10, pp. 1832-1837.
  9. Corcione M., heat transfer correlations for free convection from upward-facing horizontal rectangular surfaces, wseas transactions on heat and mass transfer, 2 (2007), 3, pp. 48-60.
  10. Brucker A. K., Majdalani J, Effective thermal conductivity of common geometric shapes, International Journal of heat and mass transfer, 48 (2005), 23-24 , pp.4779-4796.
  11. Bazylak A., Djilali N., Sinton D., Natural convection in an enclosure with distributed heat sources, Numerical heat transfer, Part A, 49 (2006), 7, pp. 655-667.
  12. Baïri, A.; Garcia de Maria, J. M.; Laraqi, N., Transient natural convection in parallelogrammic enclosures with isothermal hot wall. Experimental and numerical study applied to on-board electronics, Applied Thermal Engineering, 30 (2010), 10, pp. 1115-1125.
  13. Rashidi, M.M., Laraqi, N., Sadri, S.M., A novel analytical solution of mixed convection about an inclined flat plate embedded in a porous medium using the DTM-Padé, International Journal of Thermal Sciences, 49 (2010), 12, pp. 2405-2412.
  14. Baïri, A.; Garcia de Maria, J. M.; Laraqi, N.; et al., Free convection generated in an enclosure by alternate heated bands. Experimental and numerical study adapted to electronics thermal control, International Journal of Heat and Fluid Flow, 29 (2008), 5, pp. 1337-1346.
  15. Lewandowski W.M., Kubski P., Methodical Investigation of Free Convection from Vertical and Horizontal Plates, Warme-und Stoffubertragung, 17 (1983), pp.147-154.
  16. Yovanovich M.M, Summary of convection correlation equations, ME353 heat transfer 1, department of mechanical engineering university of Waterloo, 1997.
  17. Yovanovitch M.M., Jafarpur K., Models of laminar natural convection from vertical and horizontal isothermal cuboids for all Prandlt numbers and all Rayleigh numbers below 1011, ASME Winter Annual Meeting, New Orleans, LA, HTD- 264 (1993), pp.111-126.
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