Transient and cyclic effects on a PCM-cooled mobile device

Abstract

A mock handset with heat storage unit (HSU) has been designed, fabricated, and experimented under various conditions to examine the effect of external heat sink on the handset's transient temperature distribution, performance of the individual HSU under different power level and orientation, as well as under the more realistic cyclic heating. The cooling of the handset is through using a phase change material (PCM), n-eicosane, stored in the external HSU connected to the handset through a miniature heat pipe. The heat pipe channels the internal heat dissipation to the HSU where it is absorbed by the PCM. Results show that the temperature is significantly lowered with the PCM-based HSU.

Keywords

Dates

  • Submission Date2012-12-06
  • Revision Date2013-08-05
  • Acceptance Date2013-08-05
  • Online Date2013-08-17

DOI Reference

10.2298/TSCI121206112T

References

  1. Walsh, E., Grimes, R. and Walsh, P. The performance of active cooling In a mobile phone. ITHERM 2008, Limerick, Ireland, May 28-30, 2008, IEEE Xplore 2008, pp. 44-48.
  2. Pentikousis, K. 2010, In search of energy-efficient mobile networking. IEEE Communications Magazine, Vol 48, pp. 95-103.
  3. Woh, M., Mahlke, S., Mudge, T. and Chakrabarti, C. 2010, Mobile supercomputers for the next-generation cell phone. IEEE Xplore 2010 , Computing, pp. 81-85.
  4. Luo, Z., Cho, H., Luo, X. and Cho, K. 2008 System thermal analysis for mobile phone. 2008, Applied Thermal Engineering, Vol. 28, pp. 1889-1895.
  5. Moon, S.W., Prstic, S. and Chiu, C.P. 2008, Thermal management of a stacked-die package in a handheld electronic device Using Passive Solutions. IEEE Transactions on Components and Pckaging Technologies, Vol 31, pp. 204-210.
  6. Cher, B. and Veatch, M. 2007, Chip scale package design for thermal performance in mobile handsets. Electronic Components and Technology Conference, 57th, Reno, NV, USA, May 29-June 1, 2007, pp. 1415-1419.
  7. Hodes, M., Weistein, R.D., Pence, S.J., Piccini, J.M. 2002,Transient thermal management of a handset using phase change material (PCM). Journal of Electronic Packaging, Transactions of the ASME, Vol. 124, pp. 419-426.
  8. Tan, F.L. and Fok, S.C. 2007, Thermal management of mobile phone using phase change material. IEEE 9th Electronics Packaging Technology Conference, EPTC 2007, Singapore. pp. 836-842.
  9. Tan, F.L. and Tso, C.P. 2004, Cooling of mobile electronic devices using phase change materials, Journal of Applied Thermal Engineering, Vol. 24, pp. 159-169.
  10. Shatikian, V., Ziskind, G. and Letan, R. 2005, Numerical investigation of a PCM-based heat sink with internal fins. International Journal of Heat and Mass Transfer, Vol 48, pp. 3689-3706.
  11. Wang, J, Chen, G and Jiang, H. 1999,Theoretical study on a novel phase change process. Int J Energy Res., Vol 23, pp. 287-294.
  12. Hawlader, M.N.A, Uddin, M.S and Khin, M.M. 2003, Microencapsulated PCM thermal energy storage system. Applied Energy, Vol 74, pp. 195-202.
  13. Weng, Y.C., Cho, H.P., Chang, C.C. and Chen, S.L. 2011, Heat pipe with PCM for electronic cooling, Journal of Applied Energy, Vol. 88, pp. 1825-1833.