HEAT TRANSFER AND STRUCTURE STRESS ANALYSIS OF MICRO PACKAGING COMPONENT OF HIGH POWER LIGHT EMITTING DIODE

Abstract

This paper focuses on the heat transfer and structural stress analysis of the micro-scale packaging structure of a high-power light emitting diode. The thermaleffect and thermal-stress of light emitting diode are determined numerically. Light emitting diode is attached to the silicon substrate through the wire bonding process by using epoxy as die bond material. The silicon substrate is etched with holes at the bottom and filled with high conductivity copper material. The chip temperature and structure stress increase with input power consumption. The micro light emitting diode is mounted on the heat sink to increase the heat dissipation performance, to decrease chip temperature, to enhance the material structure reliability and safety, and to avoid structure failure as well. This paper has successfully used the finite element method to the micro-scale light emitting diode heat transfer and stress concentration at the edges through etched holes.

Keywords

Dates

  • Submission Date2013-01-18
  • Revision Date2013-04-26
  • Acceptance Date2013-04-27
  • Online Date2013-12-28

DOI Reference

10.2298/TSCI1305277H

References

  1. Arik, M., et al., Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes, The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2002), San Diego, Cal., USA, 2002, pp. 113-120
  2. Arik, M., et al., Thermal Management of LEDs: Package to System, Third International Conference on Solid State Lighting, Proceedings of SPIE, SPIE, Bellingham, Wash., USA, 2004, Vol. 5187, pp. 64-75
  3. Tsou, C. F., Huang, Y. S., Silicon-Based Packaging Platform for Light-Emitting Diode, IEEE Transactions on Advanced Packaging, 29 (2006), 3, pp. 607-614
  4. Yuan, L., et al., Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler, 7th International Conference on Electronic Packaging Technology (ICEPT'06), Shanghai, China, 2006, pp. 1-5
  5. Lee, C. Y., Liu, J. L., Illumination Based on High-Power White Light-Emitting Diode Array, International Journal of Green Energy, 9 (2012), 5, pp. 421-429
  6. Christensen, A., Graham, S., Thermal Effects in Packaging High Power Light Emitting Diode Arrays, Applied Thermal Engineering, 29 (2009), 2, pp. 364-371
  7. Vipradas, A., et al., A Parametric Study of a Typical High Power LED Package to Enhance overall Thermal Performance, 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), San Diego, Cal., USA, 2012, pp. 308-313
  8. Yan, B., et al., Influence of Die Attach Layer on Thermal Performance of High Power Light Emitting Diodes, IEEE Transactions on Components and Packaging Technologies, 33 (2009), 4, pp. 722-727
  9. Feng, W. F., et al., Packaging and AC Powering of LED Array, Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, Nev., USA, 2010, pp. 512-514
  10. Jang, S. H., Shin, M. W., Thermal Analysis of LED Arrays for Automotive Headlamp with a Novel Cooling System, IEEE Transactions on Device and Materials Reliability, 8 (2008), 3, pp. 561-564
  11. Chi, W. H., et al., Analysis of Thermal Performance of High Power Light Emitting Diodes Package, 10th Electronics Packaging Technology Conference (EPTC), Singapore, 2008, pp. 533-538
  12. Robert, F., Karlicek, J., High Power LED Packaging, IEEE Conference on Lasers and Electro-Optics (CLEO), Baltimore, Md., USA, 2005, Vol. 1, pp. 337-339
Volume 17, Issue 5, Pages1277 -1283