EXPERIMENTAL ANALYSIS OF PARALLEL PLATE AND CROSSCUT PIN FIN HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS

Abstract

Experimental investigation of parallel plate fin and the crosscut pin fin heat sinks where the heating element placed asymmetrically is performed. Theoretical calculations were done and compared with the experimental results. A comparative study was made based on their efficiencies, heat transfer coefficient, and the thermal performance. From the experimental results it was found that the average heat transfer coefficient of parallel plate fins is higher than that of crosscut pin fins with many perforations. However the performance efficiency of both the crosscut pin fins and parallel plate fins is similar. A hybrid approach was employed to significantly optimize the distance between the fan and heat sink for parallel plate and crosscut pin fins. Parallel plate heat sink with an average heat transfer coefficient of 46 W/m²K placed at an optimum fan distance of 40-60 mm is selected as the suitable choice for the micro-electronic cooling when the heating element is placed asymmetrically.

Keywords

Dates

  • Submission Date2008-11-21
  • Revision Date2009-06-04
  • Acceptance Date2009-07-19

DOI Reference

10.2298/TSCI1001147S

References

  1. Bar-Cohen, A., Thermal Management of Electric Components with Dielectric Liquids, (Eds. J. R. Lloyd, Y. Kurosaki), Proceedings, ASME/JSME Thermal Engineering Joint Conference, Maui, Hawaii, USA, Vol. 2, 1996), pp. 15-39
  2. Ellison, G. N., Thermal Computations for Electronic Equipment, 2nd ed., Van Nostrand Reinhold Corporation, New York, USA, 1989
  3. Kraus, A. D., Bar-Cohen, A., Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation, Washington, USA, 1983
  4. Sasaki, S., Kishimoto, T., Optimal Structure for Microgroove Cooling Fin for High Power LSI Devices, Electronics Letters, 22 (1986), 25, pp. 1332-1334
  5. Azar, K., McLeod, R. S., Caron, R. E., Narrow Channel Heat Sink for Cooling of High Powered Electronic Components, Proceedings, 8th Annual IEEE Semi-Therm Symposium, Austin, Tex., USA, 1992, pp. 12-19
  6. Knight, R. W., Goodling, J .S., Hall, D. J., Optimal Thermal Design of Forced Convection Heat Sinks-Analytical, ASME Journal of Electronic Packaging, 113 (1991), 3, pp. 313-321
  7. Knight, R. W., Hall, D. J., Goodling, J. S., Jaeger, R. C., Heat Sink Optimization with Application to Microchannels, IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15 (1992), 5, pp. 832-842
  8. Wirtz, R. A., Chen, W., Zhou, R., Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks, ASME Journal of Electronic Packaging, 116 (1994), 3, pp. 206-211
  9. Keyes, R. W., Heat Transfer in Forced Convection through Fins, IEEE Transactions on Electronic Devices, ED-31 (1984), 9, pp. 1218-1221
  10. Bartilson, B. W., Air Jet Impingement on a Miniature Pin-Fin Heat Sink, ASME Paper No. 91-WA-EEP-41, 1991
  11. Matsushita, H., Yanagida, T., Heat Transfer from LSI Packages with Longitudinal Fins in a Free Air Stream, Proceedings, Advances in Electronic Packaging, Binghamton, N. Y., USA, 1993, EEP, Vol. 4, Part 2, pp. 793-800
  12. Lee, S., Optimum Design and Selection of Heat Sinks, Proceedings, 11th IEEE Semi-Therm Symposium, San Jose, Cal., USA, 1995, pp. 48-54
  13. Chapman, C. L., Lee, S., Thermal Performance of an Elliptical Pin Fin Heat Sink, Proceedings, 10th IEEE Semi-Therm Symposium, San Jose, Cal., USA, 1994, pp. 24-31
  14. de Lieto Vollaro, A., Grignaffini, S., Gugliermetti, F., Optimum Design of Vertical Rectangular Fin Arrays, International Journal of Thermal Science, 38 (1999), 6, pp. 525-529
  15. Culham, J. R., Muzychka, Y. S., Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization, IEEE Transactions on Components and Packaging Technologies, 24 (2001), 2, pp. 159-165
  16. Park, K., Moon, S., Optimal Design of Heat Exchangers Using the Progressive Quadratic Response Surface Model, International Journal of Heat and Mass Transfer, 42 (2000), 11, pp. 237-244
  17. Park, K., Choi, D. H., Lee, K. S., Optimum Design of Plate Heat Exchanger with Staggered Pin Arrays, Numerical Heat Transfer., Part A, Applications, 45 (2004), 4, pp. 347-361
  18. Park, K., Choi, D. H., Lee, K. S., Numerical Shape Optimization for High Performance of a Heat Sink with Pin-Fins, Numerical Heat Transfer. Part A, Applications, 46 (2004), 9, pp. 909-927
  19. Yu, X., et al., Development of a Plate-Pin Fin Heat Sink and its Performance Comparisons with a Plate Fin Heat Sink, Applied Thermal Engineering, 25 (2005), 2-3, pp.173-182
  20. Chiang, Ko-Ta., Chang, Fu-Ping., Application of Response Surface Methodology in the Parametric Optimization of a Pin-Fin Type Heat Sink, International Communications in Heat and Mass Transfer, 33 (2006), 7, pp. 836-845
  21. Bejan, A., Kraus, A. D., Heat Transfer Hand Book, John Wiley and Sons - Interscience Publishers, New York, USA, 2003
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