MICROCHANNELS IN MACRO THERMAL MANAGEMENT SOLUTIONS

Abstract

Modern progress in electronics is associated with increase in computing ability and processing speed, as well as decrease in size. Future applications of electronic devices in aviation, aero space and high performance consumer products' industry demand on very strin gent specifications concerning miniaturization, com po nent den sity, power density and reliability. Excess heat produces stresses on internal components inside the electronic device, thus creating reliability problems. Thus, a problem of heat generation and its efficient removal arises and it has led to the development of advanced thermal control systems. Present research analyses a thermodynamic feasibility of micro capillary heat pumped networks in thermal management of electronic systems, considers basic technological constrains and design availability, and identifies perspective directions for the further studies. Computer Fluid Dynamics studies have been performed on the laminar convective heat transfer and pressure drop of working fluid in silicon micro-channels. Surface roughness is simulated via regular, constructal, and stochastic models. Three-dimensional numerical solution shows significant effects of surface roughness in terms of the rough element geometry such as height, size, spacing and the channel height on the velocity and pressure fields.

Keywords

Dates

  • Submission Date2004-12-02
  • Revision Date0000-00-00
  • Acceptance Date0000-00-00

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